The extreme temperature capability of an industrial grade product is a key feature benefit over commercial grade products. The cycling of extremely high and low temperatures in a working environment is commonly found in industrial applications. For example, a telecom base station in North America may be situated in a climate with a temperature of -30°C in winter and 30°C in summer. The regular commercial grade product, rated from 0°C to 70°C-85°C, can cause problems for a base station to function properly, due to the fact that the surrounding temperature will fall below 0°C at times.
To face the challenge of satisfying wide temperature (WT) working requirements, ATP utilizes its unique technologies, the IC Level testing for DRAM solutions, and the system level burning-in testing for both DRAM and Flash solutions, to ensure the products meet and exceed extreme WT operating conditions, which ranges from -40°C to 85°C.
In addition, application-specific test patterns can be programmed and run on the Automatic Test Equipment (ATE) for each customer’s exclusive operating criteria. This new solution targets industrial DRAM module applications such as telecom, networking, IPC, automation and ruggedized systems, and achieves the best total cost ownership (TCO) with long term system reliability.
In terms of NAND Flash products, only very particular flash IC and IC packaging configurations can meet the industrial grade operating temperature range of -40°C to 85°C. ATP specializes in these configurations, which allow for 24/7 wider temperature operation, with an reasonable total cost ownership.