ATP has successfully integrated the DRAM ATE and TDBI tests and the SCADA system into one mass-production-scale burn-in system. ATP focuses on maximizing the ATE testing coverage and accelerating the TDBI testing cycle. A traceable quality record from IC level testing (from DRAM module level ATE production data to field product usage) has been built, massively collected, and analyzed via the SCADA system. The entire system is designed to (1) build a system for quality data acquisition, and (2) implement a system for process improvement, based on the quality and reliability driven industrial and server environments. The new system provides a wide testing temperature ranging from -40°to 85°C, which few other TDBI systems can provide. The combined tests have proven to effectively lower the field return rates from major ATP OEM customers by up to 30%. The system has again demonstrated ATP’s add on value and its commitments to indusial-grade quality and reliability.
The ATP TDBI system features a unique chamber design allowing for flexibility in customer specific temperature profiles and also features a flexible monitoring/control system.
The elevated temperature burn in process reduces field failures due to fringe manufacturing defects and IC infant mortality. The design of the thermal chamber allows for a higher level of production level efficiency, scalability, and flexibility.
ATE provides electrical testing patterns with various parameter settings, such as marginal voltage, signal frequency, clock, command timing and data timing under continuous thermal cycles. For specific weaknesses of some ICs, ATE can provide specific testing patterns to stress the screening of the potential defects during the testing. Also, based on customers’ requests, tailor-made electrical testing patterns can be programmed and implemented into the ATE testing process. The ATE testing system is also able to pin point individual defective ICs and defective DRAM PCB boards, providing a much more efficient failure analysis method for both new product development and mass production stages.
By combining the ATP TDBI System and the ATE tests, the elevated temperature and critical testing signal patterns accelerate the detection of IC infant mortality and enable IC batch screening, improving incoming IC quality control. This promotes overall ATP DRAM module quality to a new level. Since these systems offer both application and system specific testing, they also perform as powerful tools for product failure mode analysis. Both systems have the capability for swift scalability and ramp up during mass production.
The SCADA feature of the TDBI system allows for true flexibility in application/customer specific temperature profiles and data patterns (customer specific software/ scripts). The SCADA also offers real time monitoring and production lot logging for QA traceability