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e.MMC

Key features
  • Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
  • 153-ball FBGA (RoHS compliant, "green package")
  • Industrial operating temperature range -40°C to 85°C
  • LDPC ECC engine*
  • Designed with 3D NAND
  • Capacities: 16 GB to 128 GB
  • SRAM soft error detection
  • AutoRefresh, Dynamic Data Refresh read disturb management
  • Extra-high endurance: 2-3X higher than standard e.MMC

* Low-density parity-check error correcting code. By project support.


The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing.

Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments.

ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40°C to blistering hot 85°C will not cause adverse impact on the device or the data in it.

Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache Flushing Report ensures the data integrity on cache blocks; Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device.

It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.

Product

e.MMC

Product Line

Premium

Superior

Naming

E700p

E600i

IC Package

153-ball FBGA

JEDEC Specification

v5.1, HS400

Flash Type

3D SLC Mode

3D NAND

Density*

8 GB to 64 GB

16 GB to 128 GB

Bus Speed Modes

x1/x4/x8

x1/x4/x8

Performance**

Sequential Read/Write
up to  (MB/s)

300/220

300/220

Random Read/Write
up to (IOPS)

15K / 30K

15K / 30K

Operating Temperature

-40°C to 85°C
(industrial)

Reliability

Max. TBW***

651 TB

372 TB

MTBF @ 25°C

> 2,000,000 Device hours

> 2,000,000 Device hours

VCC  (Typical RMS in Read/Write)

130 / 215

130 / 215

VCCQ  (Typical RMS in Read/Write)

115 / 105

115 / 105

L x W x H (mm)

11.5 x 13.0 x 1.3 (max.)

*1GB=1,000,000,000 bytes. Actual user storage may be less. 
**Based on internal testing; performance may vary depending upon drive capacity, file attributes, host device, OS and application. Cache On.
***Under best write amplification index (WAI) with highest sequential write value. May vary by density, test configuration, workload and applications.

 

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