ATP e.MMC: Built Small for Big Industrial Storage Demands
Soldered-down tiny storage delivers solid performance and reliability
in challenging operating environments
Taipei, Taiwan (August 2018) – Fueled by continuous big data generation, the ongoing industrial revolution requires storage solutions that offer not only high performance, but also uncompromising reliability and maximum endurance. ATP Electronics, a leading manufacturer of industrial memory and storage solutions, tackles these tough storage demands with its new industrial e.MMC product family.
Big Features in a Tiny Package
Constructed with 3D NAND flash and with densities of up to 128 GB, the ATP e.MMC has an industrial operating temperature rating (-40°C to 85°C) for exceptional thermal tolerance in extremely hot or cold environments. It comes in a 153-ball fine pitch ball grid array (FBGA) package that integrates a MultiMedia Card (MMC) interface, flash memory and controller within a single IC package that is smaller than a typical postage stamp. The integrated package allows the e.MMC to internally manage basic functions such as error correction, bad block management and wear leveling, thus freeing the host from having to perform low-level flash operations. Being soldered directly to the printed circuit board, the e.MMC is resistant against vibrations, ensuring reliable performance even during grueling operations. The compact package, ample capacity and low power consumption make the ATP e.MMC perfect for handling big data while taking up small space.
"We are very proud to introduce the new industrial e.MMC, which achieves unprecedented reliability and 2-3X the endurance of standard e.MMC solutions, thanks to the superior IC NAND flash characterization as well as intense testing and validation that ATP has always been known for," said Marco Mezger, ATP Vice President of Global Marketing.
The e.MMC v5.1 standard enables new features such as Command Queuing and Cache Barrier to enhance random read/write performance; Enhanced Strobe in HS400 Mode for faster synchronization between the host and the e.MMC device; Cache Flushing Report to ensure data integrity on cache blocks; and, Secure Write Protection to ensure that only trusted entities can protect or unprotect the e.MMC device. ATP e.MMC is backward compatible with previous e.MMC versions (v4.41/v4.5/v5.0).
To ensure the highest levels of performance, utmost reliability, better endurance, and product longevity, the ATP e.MMC employs smart solutions such as Advanced Global Wear Leveling and SSD-level low-density parity check error correction code (LDPC ECC) technology for increased endurance. AutoRefresh and Dynamic Data Refresh guard against read disturb errors while SRAM soft error detector technology monitors error bit levels during device operation to ensure data integrity; and, the Early Retirement technology prevents data loss from weak blocks.
The S.M.A.R.T. (Self-Monitoring, Analysis, and Reporting Technology) function monitors endurance and reliability attributes to prevent unexpected data loss when the flash memory nears or reaches its end life, so device replacement plans can be made ahead of time.